Thick-Film Hybrid Integrated Circuits Market Research Report 2022

The global Thick-Film Hybrid Integrated Circuits market was valued at 5021 Million USD in 2021 and will grow with a CAGR of 4.55% from 2021 to 2027, based on Research newly published report.

The prime objective of this report is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).

Thick film hybrid integrated circuit (THIC) is a kind of hybrid integrated circuit, which is made of passive network on the same substrate by thick film process such as screen printing and sintering, and then assembled with discrete semiconductor chip or monolithic integrated circuit or micro component, and then packaged. The characteristics of thick film hybrid integrated circuit: compared with discrete component circuit, hybrid integrated circuit has the characteristics of high density, high reliability and better electrical performance; compared with PCB Compared with monolithic integrated circuit, it is flexible in design, simple in process, convenient in production of many varieties and small batch, and has wide parameter range, high precision, and can withstand high voltage and large output In terms of digital circuits, although semiconductor integrated circuits give full play to the characteristics of miniaturization, high reliability and large-scale low-cost production, thick film hybrid integrated circuits still maintain their advantages over semiconductor integrated circuits in many aspects, such as low-noise circuits, high-stability passive networks, high-frequency linear circuits High precision linear circuit, microwave circuit, high-voltage circuit, high-power circuit and mixed analog-to-digital circuit.The main sales regions of thick film hybrid IC are Asia Pacific and North America, which together occupy about 60% of the global market share in 2019.

By Market Verdors:

  • International Rectifier (Infineon)
  • Crane Interpoint
  • GE Aviation
  • MDI
  • MSK (Anaren)
  • Technograph Microcircuits
  • Cermetek Microelectronics
  • Midas Microelectronics
  • NAURA Technology Group Co., Ltd.
  • JRM
  • International Sensor Systems
  • Zhenhua Microelectronics Ltd.
  • Xin Jingchang Electronics Co.,Ltd
  • E-TekNet
  • China Electronics Technology Group Corporation
  • Kolektor Siegert GmbH
  • Advance Circtuit Technology
  • AUREL s.p.a.
  • Fenghua Advanced Technology Holding CO.,LTD,
  • Custom Interconnect
  • Integrated Technology Lab
  • Chongqing Sichuan Instrument Microcircuit Co., Ltd.

By Types:

  • Al2O3 Ceramic Substrate
  • BeO Ceramic Substrate
  • Ain Substrate

By Applications:

  • Aviation and National Defense
  • Automotive Industry
  • Telecommunication and Computer Industry
  • Consumer Electronics

Key Indicators Analysed

  • Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market?s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.
  • Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.
  • Market Trends: Market key trends which include Increased Competition and Continuous Innovations.
  • Opportunities and Drivers: Identifying the Growing Demands and New Technology
  • Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

Key Reasons to Purchase

  • To gain insightful analyses of the market and have comprehensive understanding of the global market and its commercial landscape.
  • Assess the production processes, major issues, and solutions to mitigate the development risk.
  • To understand the most affecting driving and restraining forces in the market and its impact in the global market.
  • Learn about the market strategies that are being adopted by leading respective organizations.
  • To understand the future outlook and prospects for the market.
  • Besides the standard structure reports, we also provide custom research according to specific requirements

Table of content

1 Report Overview

1.1 Study Scope

1.2 Key Market Segments

1.3 Players Covered: Ranking by Thick-Film Hybrid Integrated Circuits Revenue

1.4 Market Analysis by Type

1.4.1 Global Thick-Film Hybrid Integrated Circuits Market Size Growth Rate by Type: 2021 VS 2027

1.4.2 Al2O3 Ceramic Substrate

1.4.3 BeO Ceramic Substrate

1.4.4 Ain Substrate

1.5 Market by Application

1.5.1 Global Thick-Film Hybrid Integrated Circuits Market Share by Application: 2022-2027

1.5.2 Aviation and National Defense

1.5.3 Automotive Industry

1.5.4 Telecommunication and Computer Industry

1.5.5 Consumer Electronics

1.6 Study Objectives

1.7 Years Considered

1.8 Overview of Global Thick-Film Hybrid Integrated Circuits Market

1.8.1 Global Thick-Film Hybrid Integrated Circuits Market Status and Outlook (2016-2027)

1.8.2 North America

1.8.3 East Asia

1.8.4 Europe

1.8.5 South Asia

1.8.6 Southeast Asia

1.8.7 Middle East

1.8.8 Africa

1.8.9 Oceania

1.8.10 South America

1.8.11 Rest of the World

2 Market Competition by Manufacturers

2.1 Global Thick-Film Hybrid Integrated Circuits Production Capacity Market Share by Manufacturers (2016-2021)

2.2 Global Thick-Film Hybrid Integrated Circuits Revenue Market Share by Manufacturers (2016-2021)

2.3 Global Thick-Film Hybrid Integrated Circuits Average Price by Manufacturers (2016-2021)

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